MacMic Science & Technology Power Discrete Devices

Use discrete devices when: (1) Power requirements are lower (< 50A continuous)

(2) Custom thermal solutions are needed

(3) Space constraints favor single devices

(4) Cost optimization for high-volume production

(5) Replacement of existing discrete designs. TO-247 packages offer good thermal performance up to 100A with proper heat sinking. Modules are preferred for higher power and integrated half-bridge configurations.

Consider power level, thermal design, and system integration requirements when choosing between discrete and module packages.

TO-220 is a smaller package suitable for currents up to 20-30A with appropriate heat sinking. It has lower thermal mass and is ideal for low-power applications. TO-247 is larger with better thermal characteristics, supporting currents up to 100A. TO-247 has lower thermal resistance (Rth) and can handle higher power dissipation. Both packages use through-hole mounting for reliable mechanical connection. Choose TO-220 for compact designs, TO-247 for higher power.

Select package based on current requirements and available heat sink size.

Proper thermal design for discrete devices includes: (1) Use thermal interface material (TIM) with conductivity >3 W/mK

(2) Ensure mounting torque of 0.8-1.2 Nm for good thermal contact

(3) Design heat sink with thermal resistance (Rth) appropriate for your power dissipation

(4) Consider forced air cooling for continuous operation above 50A

(5) Keep case temperature below 100°C for long-term reliability. Calculate junction temperature using Tj = Ta + Ploss × (Rth(j-c) + Rth(c-s) + Rth(s-a)).

Contact our FAE team for thermal design assistance and heat sink recommendations.